MAX810 datasheet(2/11 Pages) ONSEMI

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MAX809 Series, MAX810 Series

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PIN DESCRIPTION

Pin No.

Symbol

Description

GND

Ground

RESET (MAX809)

RESET output remains low while VCC is below the reset voltage threshold, and for a reset timeout

period after VCC rises above reset threshold

RESET (MAX810)

RESET output remains high while VCC is below the reset voltage threshold, and for a reset timeout

period after VCC rises above reset threshold

VCC

Supply Voltage (Typ)

ABSOLUTE MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Power Supply Voltage (VCC to GND)

VCC

−0.3 to 6.0

RESET Output Voltage (CMOS)

−0.3 to (VCC + 0.3)

Input Current, VCC

Output Current, RESET

dV/dt (VCC)

100

msec

Thermal Resistance, Junction−to−Air (Note 1)

SOT−23

SC−70

RqJA

301

314

°C/W

Operating Junction Temperature Range

−40 to +105

°C

Storage Temperature Range

Tstg

−65 to +150

°C

Lead Temperature (Soldering, 10 Seconds)

Tsol

+260

°C

ESD Protection

Human Body Model (HBM): Following Specification JESD22−A114

Machine Model (MM): Following Specification JESD22−A115

2000

200

Latchup Current Maximum Rating: Following Specification JESD78 Class II

Positive

Negative

ILatchup

200

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This based on a 35x35x1.6mm FR4 PCB with 10mm2 of 1 oz copper traces under natural convention conditions and a single component

characterization.

2. The maximum package power dissipation limit must not be exceeded.

PD +

TJ(max) * TA

qJA

with TJ(max) = 150°C

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