CS1107

http://onsemi.com

4

PACKAGE DIMENSIONS

SO–8

DF SUFFIX

CASE 751–07

ISSUE V

SEATING

PLANE

1

4

5

8

N

J

X 45

_

K

A

B

S

D

H

C

0.10 (0.004)

DIM

A

MIN

MAX

MIN

MAX

INCHES

4.80

5.00

0.189

0.197

MILLIMETERS

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.053

0.069

D

0.33

0.51

0.013

0.020

G

1.27 BSC

0.050 BSC

H

0.10

0.25

0.004

0.010

J

0.19

0.25

0.007

0.010

K

0.40

1.27

0.016

0.050

M

0

8

0

8

N

0.25

0.50

0.010

0.020

S

5.80

6.20

0.228

0.244

–X–

–Y–

G

M

Y

M

0.25 (0.010)

–Z–

Y

M

0.25 (0.010)

Z

S

M

_

___

PACKAGE THERMAL DATA

Parameter

SO–8

Unit

Typical

25

°C/W

Typical

110

°C/W

ON Semiconductor and

are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes

without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular

purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,

including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be

validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.

SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

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PUBLICATION ORDERING INFORMATION

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For additional information, please contact your local

Sales Representative.

CS1107/D

Literature Fulfillment:

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