MC74AC08, MC74ACT08

http://onsemi.com

5

MARKING DIAGRAMS

A

= Assembly Location

WL, L

= Wafer Lot

YY, Y

= Year

WW, W = Work Week

G or G = Pb−free Package

PDIP−14

SOIC−14

TSSOP−14

MC74AC08N

AWLYYWWG

AC

08

ALYWG

G

MC74ACT08N

AWLYYWWG

74AC08

ALYWG

SOEIAJ−14

74ACT08

ALYWG

ACT

08

ALYWG

G

(Note: Microdot may be in either location)

AC08G

AWLYWWG

1

14

ACT08G

AWLYWWG

1

14

1

14

1

1

1

14

14

1

14

14

1

14

ORDERING INFORMATION

Device

Package

MC74AC08N

PDIP−14

25 Units / Rail

MC74AC08NG

PDIP−14

(Pb−Free)

MC74AC08D

SOIC−14

55 Units / Rail

MC74AC08DG

SOIC−14

(Pb−Free)

MC74AC08DR2

SOIC−14

2500 / Tape & Reel

MC74AC08DR2G

SOIC−14

(Pb−Free)

MC74AC08DTR2

TSSOP−14*

MC74AC08DTR2G

TSSOP−14*

MC74AC08MEL

SOEIAJ−14

2000 / Tape & Reel

MC74AC08MELG

SOEIAJ−14

(Pb−Free)

MC74ACT08N

PDIP−14

25 Units / Rail

MC74ACT08NG

PDIP−14

(Pb−Free)

MC74ACT08D

SOIC−14

55 Units / Rail

MC74ACT08DG

SOIC−14

(Pb−Free)

MC74ACT08DR2

SOIC−14

2500 / Tape & Reel

MC74ACT08DR2G

SOIC−14

(Pb−Free)

MC74ACT08DTR2

TSSOP−14*

MC74ACT08DTR2G

TSSOP−14*

MC74ACT08MEL

SOEIAJ−14

2000 / Tape & Reel

MC74ACT08MELG

SOEIAJ−14

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*This package is inherently Pb−Free.