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STD4NK100Z Datasheet(PDF) 2 Page - STMicroelectronics |
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STD4NK100Z Datasheet(HTML) 2 Page - STMicroelectronics |
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2 / 15 page ![]() 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage 1000 V VGS Gate-source voltage ±30 V ID Drain current (continuous) at TC = 25 °C 2.2 A Drain current (continuous) at TC = 100 °C 1 IDM(1) Drain current (pulsed) 8.8 A PTOT Total power dissipation at TC = 25 °C 90 W ESD Gate-source human body model (R = 1.5 kΩ, C = 100 pF) 3 kV dv/dt(2) Peak diode recovery voltage slope 4.5 V/ns Tstg Storage temperature range -55 to 150 °C TJ Operating junction temperature range 1. Pulse width limited by safe operating area. 2. ISD ≤ 2.2 A, di/dt ≤ 200 A/μs, VDS (peak) ≤ V(BR)DSS, VDD ≤ V(BR)DSS. Table 2. Thermal data Symbol Parameter Value Unit RthJC Thermal resistance, junction-to-case 1.39 °C/W RthJA (1) Thermal resistance, junction-to-ambient 50 °C/W 1. When mounted on 1 inch² FR-4, 2 Oz copper board. Table 3. Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not repetitive (pulse width limited by TJ max.) 2.5 A EAS Single pulse avalanche energy (starting TJ = 25 °C, ID = IAR, VDD = 50 V) 110 mJ STD4NK100Z Electrical ratings DS8902 - Rev 3 page 2/15 |
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