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BYD33J Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BYD33J
Description  Fast soft-recovery controlled avalanche rectifiers
PDF  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BYD33J Datasheet(HTML) 2 Page - NXP Semiconductors

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1996 Sep 18
2
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD33 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• Available in ammo-pack.
DESCRIPTION
Cavity free cylindrical glass package
through Implotec
™(1) technology.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
(1) Implotec is a trademark of Philips.
Fig.1 Simplified outline (SOD81) and symbol.
handbook, 4 columns
a
k
MAM123
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRRM
repetitive peak reverse voltage
BYD33D
−
200
V
BYD33G
−
400
V
BYD33J
−
600
V
BYD33K
−
800
V
BYD33M
−
1000
V
BYD33U
−
1200
V
BYD33V
−
1400
V
VR
continuous reverse voltage
BYD33D
−
200
V
BYD33G
−
400
V
BYD33J
−
600
V
BYD33K
−
800
V
BYD33M
−
1000
V
BYD33U
−
1200
V
BYD33V
−
1400
V
IF(AV)
average forward current
Ttp =55 °C; lead length = 10 mm;
see Figs 2 and 3;
averaged over any 20 ms period;
see also Figs 10 and 11
BYD33D to M
−
1.30
A
BYD33U and V
−
1.26
A
IF(AV)
average forward current
Tamb =65 °C; PCB mounting (see
Fig.19); see Figs 4 and 5;
averaged over any 20 ms period;
see also Figs 10 and 11
BYD33D to M
−
0.70
A
BYD33U and V
−
0.67
A
IFRM
repetitive peak forward current
Ttp =55 °C; see Figs 6 and 7
BYD33D to M
−
12
A
BYD33U and V
−
11
A



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