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BYD47 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BYD47
Description  Fast soft-recovery controlled avalanche rectifiers
PDF  12 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BYD47 Datasheet(HTML) 2 Page - NXP Semiconductors

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1999 Nov 11
2
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD47 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Shipped in 8 mm embossed tape
• Smallest surface mount
rectifier outline.
DESCRIPTION
Cavity free cylindrical glass SOD87
package through Implotec
™(1)
technology. This package is
hermetically sealed and fatigue free
as coefficients of expansion of all
used parts are matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
MAM061
ka
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRSM
non-repetitive peak reverse voltage
BYD47-16
−
1700
V
BYD47-18
−
1900
V
BYD47-20
−
2100
V
VRRM
repetitive peak reverse voltage
BYD47-16
−
1600
V
BYD47-18
−
1800
V
BYD47-20
−
2000
V
IF(AV)
average forward current
Ttp = 105 °C; see Fig.2;
averaged over any 20 ms period;
see also Fig.6
−
0.80
A
IF(AV)
average forward current
Tamb =25 °C; PCB mounting (see
Fig.11); see Fig.3;
averaged over any 20 ms period;
see also Fig.6
−
0.34
A
IFRM
repetitive peak forward current
Ttp =85 °C; see Fig.4
−
8.0
A
Tamb =65 °C; see Fig.5
−
2.8
A
IFSM
non-repetitive peak forward current
t = 10 ms half sine wave; Tj =Tj max
prior to surge; VR =VRRMmax
−
10
A
Tstg
storage temperature
−65
+175
°C
Tj
junction temperature
see Fig.7
−65
+175
°C



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