BYG85B datasheet(2/12 Pages) PHILIPS

2 / 12 page

1998 Nov 25

Philips Semiconductors

Product speciﬁcation

Fast soft-recovery rectiﬁer

BYG85B

FEATURES

• Glass passivated

• High maximum operating

temperature

• Low leakage current

• Excellent stability

• UL 94V-O classified plastic

package

• Shipped in 12 mm embossed tape.

DESCRIPTION

DO-214AC surface mountable

package with glass passivated chip.

The well-defined void-free case is of a

transfer-moulded thermo-setting

plastic.

Fig.1 Simplified outline (DO-214AC; SOD106) and symbol.

handbook, 4 columns

MSA474

Top view

Side view

cathode

band

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

VRRM

repetitive peak reverse voltage

−

100

continuous reverse voltage

−

100

IF(AV)

average forward current

Ttp = 100 °C; averaged over any

20 ms period; see Figs 2 and 7

−

2.5

IF(AV)

average forward current

Tamb =60 °C; AL2O3 PCB mounting

(see Fig.11); averaged over any

20 ms period; see Fig.3

−

1.3

IF(AV)

average forward current

Tamb =60 °C; epoxy PCB mounting

(see Fig.11); averaged over any

20 ms period; see Fig.3

−

0.98

IFRM

repetitive peak forward current

Ttp = 100 °C; see Fig.3

−

IFRM

repetitive peak forward current

Tamb =60 °C; AL2O3 PCB mounting;

see Fig.5

−

IFRM

repetitive peak forward current

Tamb =60 °C; epoxy PCB mounting;

see Fig.6

−

8.5

IFSM

non-repetitive peak forward current

t = 10 ms half sine wave; Tj =Tj max

prior to surge; VR =VRRMmax

−

Tstg

storage temperature

−65

+175

°C

junction temperature

−65

+175

°C

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