14

AT24C01A/02/04/08A/16A

0180Z–SEEPR–11/06

Notes: 1. This device is not recommended for new design. Please refer to AT24C02B datasheet. For 2.7V devices used in the 4.5V to

5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact

Serial EEPROM Marketing.

Ordering Code

Package

Operation Range

8P3

8P3

8S1

8S1

8A2

8A2

8Y1

5TS1

8U3-1

Lead-free/Halogen-free/

Industrial Temperature

(–40

°C to 85°C)

Die Sale

Industrial Temperature

(–40

°C to 85°C)

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8S1

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8A2

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8Y1

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

5TS1

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8U3-1

8-ball, die Ball Grid Away Package (dBGA2)

Options

–2.7

Low-voltage (2.7V to 5.5V)

–1.8

Low-voltage (1.8V to 5.5V)