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REF7012QFKHT Datasheet(PDF) 24 Page - Texas Instruments |
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REF7012QFKHT Datasheet(HTML) 24 Page - Texas Instruments |
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24 / 43 page ![]() 8.5 Temperature Drift The REF70 is designed and tested for a minimal output voltage temperature drift, which is defined as the change in output voltage over temperature. Every unit shipped is tested at multiple temperatures to ensure that the product meets data sheet specifications. The temperature coefficient is calculated using the box method in which a box is formed by the min/max limits for the nominal output voltage over the operating temperature range. REF70 has a low maximum temperature coefficient of 2 ppm/°C from –40°C to +125°C. This method corresponds more accurately to the method of test and provides a closer estimate of actual error than the other methods. The box method specifies limits for the temperature error but does not specify the exact shape and slope of the device under test. Due to temperature curvature correction to achieve low-temperature drift, the temperature drift is expected to be non-linear. See SLYT183 for more information on the box method. The box method equation is shown in Equation 2: REF(MAX) REF(MIN) 6 REF(25 C) V V Drift 10 V Temperature Range q § · u ¨ ¸ ¨ ¸ u © ¹ (2) Temperature (°C) -50 -25 0 25 50 75 100 125 2.499 2.49925 2.4995 2.49975 2.5 2.50025 2.5005 2.50075 2.501 Figure 8-14. Output Voltage Vs Free-Air Temperature 8.6 Power Dissipation The REF70 voltage references are capable of source and sink up to 10 mA of load current across the rated input voltage range. However, when used in applications subject to high ambient temperatures, the input voltage and load current must be carefully monitored to ensure that the device does not exceeded its maximum power dissipation rating. The maximum power dissipation of the device can be calculated with Equation 3: J A D JA T T P R T u (3) where • PD is the device power dissipation • TJ is the device junction temperature • TA is the ambient temperature • RθJA is the package (junction-to-air) thermal resistance Because of this relationship, acceptable load current in high temperature conditions may be less than the maximum current-sourcing capability of the device. In no case should the device be operated outside of its maximum power rating because doing so can result in premature failure or permanent damage to the device. REF70 SNAS781G – OCTOBER 2020 – REVISED SEPTEMBER 2023 www.ti.com 24 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: REF70 |
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