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SY10E171JC Datasheet(PDF) 3 Page - Micrel Semiconductor |
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SY10E171JC Datasheet(HTML) 3 Page - Micrel Semiconductor |
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3 / 4 page ![]() 3 SY10E171 SY100E171 Micrel, Inc. M9999-032006 hbwhelp@micrel.com or (408) 955-1690 TRUTH TABLE Pin State Operation SEL2 H Output c/d data SEL1A H Input d data SEL1B H Input b data DC ELECTRICAL CHARACTERISTICS AC ELECTRICAL CHARACTERISTICS VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND TA = 0 °CTA = +25°CTA = +85°C Symbol Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Condition IIH Input HIGH Current —— 150 —— 150 —— 150 µA — IEE Power Supply Current mA — 10E — 56 67 — 56 67 — 56 67 100E — 56 67 — 56 67 — 65 77 VEE = VEE (Min.) to VEE (Max.); VCC = VCCO = GND TA = 0 °CTA = +25°CTA = +85°C Symbol Parameter Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Unit Condition tPD Propagation Delay to Output ps — D 275 480 650 275 480 650 275 480 650 SEL1 450 650 850 450 650 850 450 650 850 SEL2 350 550 700 350 550 700 350 550 700 tskew Within-Device Skew ps 1 Dnm, Dnm to Qn — 60 —— 60 —— 60 — Da, Db, Dc, Dd to Q — 40 —— 40 —— 40 — tr Rise/Fall Time 300 475 650 300 475 650 300 475 650 ps — tf 20% to 80% Note: 1. Within-device skew is defined as identical transitions on similar paths through a device; n = 0, 1, 2 m = a, b, c, d. |
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