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APW8868B Datasheet(PDF) 21 Page - Anpec Electronics Coropration

Part # APW8868B
Description  DDR2 AND DDR3/DDR3L SYNCHRONOUS BUCK CONTROLLER WITH 1.5A LDO SUPPORT LOW IQ & DROOP
PDF  26 Pages
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Manufacturer  ANPEC [Anpec Electronics Coropration]
Direct Link  http://www.anpec.com.tw
Logo ANPEC - Anpec Electronics Coropration

APW8868B Datasheet(HTML) 21 Page - Anpec Electronics Coropration

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Copyright
© ANPEC Electronics Corp.
Rev. A.3 - Oct., 2017
www.anpec.com.tw
21
APW8868B
Application Information (cont.)
- Keep the switching nodes (UGATE, LGATE, BOOT, and
PHASE) away from sensitive small signal nodes(VFB,
VTTREF, and CS) since these nodes are fast moving
signals. Therefore, keep traces to these nodes as short
as possible and there should be no other weak signal
traces in parallel with theses traces on any layer.
- The signals going through theses traces have both high
dv/dt and high di/dt, with high peak charging and dis-
charging current. The traces from the gate drivers to the
MOSFETs (UGATE and LGATE) should be short and wide.
- Place the source of the high-side MOSFET and the drain
of the low-side MOSFET as close as possible. Minimiz-
ing the impedance with wide layout plane between the
two pads reduces the voltage bounce of the node.
- Decoupling capacitor, the resistor dividers, boot
capacitors, and current limit stetting resistor should be
close their pins. (For example, place the decoupling ce-
ramic capacitor near the drain of the high-side MOSFET
as close as possible. The bulk capacitors are also placed
near the drain).
- The input capacitor should be near the drain of the up-
per MOSFET; the high quality ceramic decoupling capaci-
tor can be put close to the VCC and GND pins; the VTTREF
decoupling capacitor should be close to the VTTREF pin
and GND; the VDDQ and VTT output capacitors should
be located right across their output pin as close as pos-
sible to the part to minimize parasitic. The input capacitor
GND should be close to the output capacitor GND and
the lower MOSFET GND.
- The drain of the MOSFETs (VIN and PHASE nodes)
should be a large plane for heat sinking. And PHASE pin
traces are also the return path for UGATE. Connect this
pin to the converter
’s upper MOSFET source.
- The APW8868B used ripple mode control. Build the re-
sistor divider close to the VFB pin so that the high imped-
ance trace is shorter. And the VFB pin traces can
’t be
closed to the switching signal traces (UGATE, LGATE,
BOOT, and PHASE).
- The PGND trace should be a separate trace, and inde-
pendently go to the source of the low-side MOSFETs for
current limit accuracy.
Layout Consideration
Figure3. Recommended Minimum Footprint
0.4mm
0.2mm
0.5mm
3mm
* Just Recommend
TQFN3x3-20
0.5mm *
3mm
1.66 mm
0.17mm



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