Product Family: High Power Chip Resistor

Construction:

•

99.5% BeO or 99.6% Alumina Ceramic

•

Nickel alloy thin film resistive element

•

Epoxy-resin overcoat

•

Pre-tinned (Sn100, matte) terminations

over Ni barrier

Features:

•

TCR’s to ± 25ppm

•

Tolerances less than ± 1%

•

Custom and standard sizes available

•

High volume production, suitable for

commercial and special applications

Description:

These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A

lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result,

much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power.

The BP series effectively integrates the power resistor with the board, providing a thermal resistance comparable with aluminum

heat-sinks.

Dimensions:

Size

Dimensions (mm)

Inch

Metric

L

W

H

T-top

T-btm

2512

6332

6.3 ± 0.2

3.2 ± 0.2

1.1 ± 0.1 (BP)

0.7± 0.1 (CP)

0.9 ± 0.2

2.0 ± 0.2

2525

6363

6.3 ± 0.2

6.3 ± 0.2

1.1 ± 0.1 (BP)

0.7± 0.1 (CP)

0.9 ± 0.2

2.0 ± 0.2

Call for other sizes

Electrical Specifications:

Derating Curve:

Size: Inch (Metric)

2512 (6332)

2525 (6363)

Rated Power at 70ºC 1 (BeO)

Up to 5W 1

Up to 8W 1

Rated Power at 70ºC 1 (Alumina)

Up to 2W 1

Up to 3W 1

Rated Voltage

√(PxR)

Resistance Tolerance

± 1 to 5%

Resistance Values

5 to 200 Ω, call for other

values

TCR (ppm/ºC) 2

± 25 to 200

Operating Temperature Range 3

-55 to 150ºC

Insulation Resistance (100V, 1min) 4

> 1GΩ

Notes:

1. Dependent on effective thermal conductivity of board construction/land design and size of board - greater power capability for

board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are capable of

reflowing solder bonds before device damage occurs.

2. Per MIL-PRF-55342 (-55/25/125ºC).

3. Per MIL-PRF-55342, see derating curve.

4. Per IEC 60115-1.