2000 Nov 28

8

Philips Semiconductors

Preliminary specification

GSM/DCS/PCS power amplifier

CGY2014ATW

PACKAGE OUTLINE

UNIT

A1

A2

A3

bp

Dh

eL

Lp

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.15

0.05

0.95

0.80

0.30

0.19

0.20

0.09

6.6

6.4

4.3

4.1

Eh

HE

3.1

2.9

4.5

4.3

0.65

6.6

6.2

0.5

0.2

8

0

o

o

0.13

0.1

0.2

1.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT527-1

99-11-12

00-07-12

bp

D

Dh

Eh

Z

heathsink side

e

0.25

110

20

11

θ

A

detail X

L

(A )

3

E

c

X

A

y

0

2.5

5 mm

scale

HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm

SOT527-1

A

max.

1.10

pin 1 index