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1

SUPPLY VOLTAGE, +V

350V

OUTPUT CURRENT, continuous

60mA

INPUT VOLTAGE, differential

±16V

INPUT VOLTAGE, common mode

±V

S

TEMPERATURE, junction

150°C

ABSOLUTE MAXIMUM RATINGS

NOTE:

Refer to parent product data sheet PA241 for typical AC electrical characteristics, precautions,

applications and other test parameters.

TYPICAL EXTERNAL CONNECTIONS

DIE LAYOUT

* Required component and value if given.

Optional balance components are recommended values.

C

NOTE:

Diagram for connection illustration only.

All op amp configurations are possible.

Pad

Function

Pad

Function

1

Output

5

+Vs

2

Compensation

6

-Vs

3

Compensation

8

+IN

4

Current Limit

9

-IN

procedures must be observed

Dimension: 154.5 x 117.5 ± 2.5 Mils.

Thickness: 15 Mil (380µ).

Backside Metal: None, Silicon.

Bond pad: 5 Mil sq (127µ) AI.

Make no connection to bond pads not listed by function.

Note: The backside of the CPA241 die is isolated up to

500V. The top side walls of the CPA241 die are isolated up

to 300V.

Ordering Information:

Order #: CPA241DI80:

Die are only available in waffle packages with a total of 80

die per package.

NOTES: 1.

Unless otherwise stated V

2.

Sample tested by wafer to 95%.

PARAMETER

MIN

TYP

MAX

UNITS

OFFSET VOLTAGE, initial

V

15

40

mV

BIAS CURRENT, initial

56

200

pA

COMMON MODE REJECTION

V

84

94

dB

VOLTAGE SWING

I

±V

±V

V

SUPPLY CURRENT, quiescent

V

1.8

2.1

2.3

mA

DC WAFER PROBED SPECIFICATIONS

This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.

CPA241 REV B OCTOBER 2006 © 2006 Apex Microtechnology Corp.

M I C R O T E C H N O L O G Y

CPA241