5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage, VCC+ – VCC–

37

V

VI

Input voltage

±VCC

V

IO

Output current(2)

240

mA

VIO

Differential input voltage

±1.5

V

IIN

Continuous input current

10

mA

TJ

Junction temperature

Any condition

150

°C

Continuous operation, long-term reliability(3)

125

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

When continuously operating at any output current, do not exceed the maximum junction temperature. Keep the output current less

than the absolute maximum rating regardless of time interval.

(3)

The maximum junction temperature for continuous operation is limited by package constraints. Operation greater than this temperature

can result in reduced reliability, lifetime of the device, or both.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±4000

V

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins(2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

Dual-supply

±4.5

±15

±18

V

Single-supply

9

30

36

TA

Operating free-air temperature

–40

25

85

°C

5.4 Thermal Information

THERMAL METRIC(1)

OPA892

OPAS2892

UNIT

D (SOIC)

DGN (HVSSOP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

124.5

52

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

65.0

75.2

°C/W

RθJB

Junction-to-board thermal resistance

72.2

24.5

°C/W

ΨJT

Junction-to-top characterization parameter

13.6

4

°C/W

ΨJB

Junction-to-board characterization parameter

71.4

24.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

9.1

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

OPA892

SLOSEB4 – NOVEMBER 2023

www.ti.com

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