6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Input voltage

VIN

-0.3

20

V

Enable voltage

EN

-0.3

VIN

V

Output voltage

VOUT

-0.3

VIN

V

Output short circuit current

ISC

25

mA

Operating temperature range

TA

-55

150

°C

Storage temperature range

Tstg

-65

170

°C

(1)

Stresses above these ratings can cause permanent damage. Exposure to absolute maximum conditions for extended periods can

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied. These are stress ratings only and functional operation of the device at these or any other conditions

beyond those specified in the Electrical Characteristics Table is not implied.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,

all pins(1)

± 1000

V

Charged device model (CDM), per JEDEC specification

JESD22-C101, all pins(2)

± 500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

VOUT + VDO (1)

18

V

EN

Enable voltage

0

VIN

V

NR

Noise reduction

0

6

V

IL

Output current

–10

10

mA

TA

Operating temperature

–40

25

125

°C

(1)

VDO = Dropout voltage. For VOUT < 2.5 V minimum VIN = 2.75 V

6.4 Thermal Information

THERMAL METRIC(1)

REF54

UNIT

D (SOIC)

8 PINS

RθJA

Junction-to-ambient thermal resistance

120.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

52

°C/W

RθJB

Junction-to-board thermal resistance

66

°C/W

ΨJT

Junction-to-top characterization parameter

9.8

°C/W

ΨJB

Junction-to-board characterization parameter

64.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

REF54

SNVSCN7 – NOVEMBER 2023

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