Philips Semiconductors

ISP1107

Advanced USB transceiver

Objective specification

Rev. 01 — 23 February 2000

15 of 19

9397 750 06899

© Philips Electronics N.V. 2000. All rights reserved.

Typical dwell time is 4 seconds at 250

°C. A mildly-activated flux will eliminate the

need for removal of corrosive residues in most applications.

13.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low

voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time

must be limited to 10 seconds at up to 300

°C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 to 5 seconds between 270 and 320

°C.

13.5 Package related soldering information

[1]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal

or external package cracks may occur due to vaporization of the moisture in them (the so called

popcorn effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

[2]

These packages are not suitable for wave soldering as a solder joint between the printed-circuit board

and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top

version).

[3]

If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[4]

Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger

than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[5]

Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

Table 13: Suitability of surface mount IC packages for wave and reflow soldering

methods

Package

Soldering method

Wave

BGA, LFBGA, SQFP, TFBGA

not suitable

suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, SMS

suitable

suitable

suitable

LQFP, QFP, TQFP

suitable

SSOP, TSSOP, VSO

suitable