High frequency operation

High purity, high temperature epoxy encapsulation for

enhanced mechanical strength and moisture resistance

Guard ring for enhanced ruggedness and long term reliability

Solder dip 275 °C max. 7 s, per JESD 22-B106

Typical applications are in switching power supplies, converters,

freewheeling diodes, and reverse battery protection.

Package: TO-220AB

Molding compound meets UL 94 V-0 flammability

rating, RoHS-compliant

Terminals: Tin plated leads, solderable per J-STD-

002 and JESD22-B102

Polarity: As marked

PARAMETER

SYMBOL UNIT

MBR30100CT

MBR30150CT

MBR30200CT

Device marking code

MBR30100CT

MBR30150CT

MBR30200CT

Repetitive Peak Reverse Voltage

VRRM

V

100

150

200

Average Rectified Output Current @60Hz sine

wave, R-load, Ta=25

IO

A

30

Surge(Non-repetitive)Forward Current @60Hz

half sine-wave, 1 cycle, Ta=25

IFSM

A

250

Current Squared Time @1ms t<8.3ms Tj=25

I2t

A2s

176

Storage Temperature

Tstg

-55 ~ +175

Junction Temperature

Tj

-55 ~ +175

PARAMETER

SYMBOL

UNIT

TEST CONDITIONS

MBR30100CT

MBR30150CT

MBR30200CT

Maximum instantaneous

forward voltage drop per diode

VFM

V

IFM=15.0A

0.8

0.85

0.9

Maximum DC reverse current

at rated DC blocking voltage per

diode

IRRM1

mA

VRM=VRRM

Ta=25

0.1

IRRM2

VRM=VRRM

Ta=125

20

Schottky Diodes

MBR30100CT Through MBR30200CT

TO-220AB

FEATURES

TYPICAL APPLICATIONS

MECHANICAL DATA

MAXIMUM RATINGS (Ta=25 Unless otherwise specified

ELECTRICAL CHARACTERISTICS (Ta=25 Unless otherwise specified

THERMAL CHARACTERISTICS (Ta=25 Unless otherwise specified

PARAMETER

SYMBOL

UNIT

MBR30100CT

MBR30150CT

MBR30200CT

Thermal

Resistance

Between junction and

case

R J-C

/W

2.0

PACKAGING INFORMATION

PREFERED P/N

UNIT WEIGHT(g)

MINIIMUM

PACKAGE(pcs)

INNER BOX

QUANTITY(pcs)

OUTER CARTON

QUANTITY(pcs)

DELIVERY MODE

MBR30100CT THRU MBR30200CT

Approximate 1.9

50

1000

5000

Tube

12-05-2022

Page 1 of 3

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