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LLE16045X Datasheet(PDF) 4 Page - NXP Semiconductors |
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LLE16045X Datasheet(HTML) 4 Page - NXP Semiconductors |
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4 / 12 page ![]() 1997 Feb 18 4 Philips Semiconductors Product specification NPN microwave power transistor LLE16045X THERMAL CHARACTERISTICS Note 1. See “Mounting recommendations in the General part of handbook SC19a”. CHARACTERISTICS Tj =25 °C unless otherwise specified. APPLICATION INFORMATION Microwave performance up to Tmb =25 °C in a common emitter class AB amplifier. SYMBOL PARAMETER CONDITIONS MAX. UNIT Rth j-mb thermal resistance from junction to mounting base Tj = 100 °C 8.5 K/W Rth mb-h thermal resistance from mounting base to heatsink note 1 0.2 K/W SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ICBO collector cut-off current IE = 0; VCB =20V − 75 µA V(BR)CER collector-emitter breakdown voltage IC = 1 mA; RBE = 220 Ω 30 − V V(BR)CBO collector-base breakdown voltage IC = 1 mA 45 − V V(BR)EBO emitter-base breakdown voltage IE = 1 mA 3 − V hFE DC current gain IC = 0.25 A; VCE = 5 V 15 100 MODE OF OPERATION f (GHz) VCE (V) ICQ (A) PL1 (W) Gpo (dB) ηC (%) Zi; ZL ( Ω) Class AB (CW) 1.65 24 0.04 ≥4.5 typ. 5.5 ≥8.5 typ. 9.5 typ. 50 see Figs 8 and 9 |
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