DS30355 Rev. 4 - 2

3 of 4

MBRM360

www.diodes.com

0

0.5

1

1.5

2.5

2

3

3.5

4

25

50

75

100

125

150

T , AMBIENT TEMPERATURE (°C)

A

Fig. 5 DC Forward Current Derating

Note 3

Note 4

Note 5

0

1

2

3

4

0

1

2

3

4

5

6

7

I

, AVERAGE FORWARD CURRENT (A)

F(AV)

Fig. 6 Forward Power Dissipation

Note 6

Note 7

Notes:

4.

Device mounted on GETEK substrate, 2”x2”, 2 oz. copper, double-sided, cathode pad dimensions 0.75” x 1.0”, anode pad

5. Device mounted on FR-4 substrate, 2”x2”, 2 oz. copper, single-sided, pad layout as per Diodes Inc. suggested pad layout

100-120°C/W.

6. Maximum power dissipation when the device is mounted in accordance to the conditions described in Note 4.

7. Maximum power dissipation when the device is mounted in accordance to the conditions described in Note 5.

MBRM360 = Product type marking code

= Manufacturers’ code marking

YYWW = Date code marking

YY = Last digit of year ex: 02 for 2002

WW = Week code 01 to 52

(K) = Factory Designator

YYWW(K)

MBRM360

Device

Packaging

Shipping

MBRM360-13-F

POWERMITEâ3

5000/Tape & Reel

POWERMITE is a registered trademark of Microsemi Corporation.

Notes:

8. For Packaging Details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.

Marking Information