Lead-free Green

DS30914 Rev. 2 - 2

1 of 3

TPD6V8LP

www.diodes.com

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Planar Die Construction

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Ultra-Small Leadless Surface Mount Package

·

Ideally Suited for Automated Assembly Processes

·

Lead Free By Design/RoHS Compliant (Note 1)

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"Green" Device (Note 2)

Maximum Ratings

°C unless otherwise specified

Characteristic

Symbol

Value

Unit

Forward Voltage (Note 3)

0.9

V

Operating and Storage Temperature Range

-65 to +150

°C

Peak Pulse Power (tp = 8 x 20

ms) (Note 4)

85

W

Peak Pulse Current (tp = 8 x 20

ms) (Note 4)

4.5

A

ESD Rating

Human Body Model

8kV

Machine Model

400

V

IEC61000-4-2 Air Discharge

25

kV

IEC61000-4-2 Contact Discharge

8

kV

Mechanical Data

TPD6V8LP

SURFACE MOUNT ZENER DIODE

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Case: DFN1006-2

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Case Material: Molded Plastic, "Green" Molding Compound.

UL Flammability Classification Rating 94V-0

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Moisture Sensitivity: Level 1 per J-STD-020C

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Terminal Connections: Cathode Dot

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Terminals: Finish

¾ NiPdAu annealed over Copper

leadframe. Solderable per MIL-STD-202, Method 208

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Marking & Type Code Information: 9C

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Ordering Information: See Last Page

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Weight: 0.001 grams

Features

Characteristic

Symbol

Value

Unit

Power Dissipation (Note 4)

250

mW

Thermal Resistance, Junction to Ambient Air (Note 4)

500

°C/W

DFN1006-2

Dim

Min

Max

Typ

A

0.95

1.05

1.00

B

0.55

0.65

0.60

C

0.45

0.55

0.50

D

0.20

0.30

0.25

G

0.47

0.53

0.50

H

0

0.05

0.03

N

¾¾

0.40

R

0.05

0.15

0.10

All Dimensions in mm

D

G

H

B

C

R

N

A

Notes:

1.

No purposefully added lead.

2.

Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

3.

Short duration pulse test used to minimize self-heating effect.

4.

Part mounted on FR-4 PC board with recommended pad layout, as per http://www.diodes.com/datasheets/ap02001.pdf.