Sidac

Revision March 1,2022

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For technical questions, contact: tech@unsemi.com.tw

ROHS

Specifications are subject to change without notice.

Please refer to www.unsemi.com.tw for current information.

KXXXXSB Series

3/4

Electrical Characteristics (@=25℃ unless otherwise Specified)

Figure 1- Normalized Vs change

Vs. junction temperature

Figure 2- Normalized DC holding current

Vs. case temperature

-40 -20

0

20

40

60

80 100 120 140 160

Case Temperature (TC) -

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

25℃

Soldering Parameters

Time

Time to peak temperature

( T25℃ to peak)

Preheat

Ts(min)

Ts(max)

TL

TL

TP

Ramp-up

Ramp-down

Critical Zone

TL toTP

TP

Ts

25

Lead–free assembly

150°C

200°C

60 -180 Seconds

3°C/Second max

3°C/Second max

217°C

60 -150 Seconds

260 +0/-5°C

8-15 Seconds

6°C/Second Max

8 minutes Max

260°C

Reflow Condition

Pre Heat

-Temperature Min (Ts(min))

-Temperature Max (Ts(max))

- Time (min to max) (TS)

Average ramp up rate ( Liquidus

Temp TL) to peak

TS(max) to TL - Ramp-up Rate

Reflow

- Temperature (TL) (Liquidus)

- Time (min to max) (TS)

Peak Temperature (TP)

Do not exceed

Time 25°C to peak Temperature (TP)

Time within 5°C of actual peak

Temperature (TP)

Ramp-down Rate

℃