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FDN361 Datasheet(PDF) 2 Page - Guangdong Youtai Semiconductor Co., Ltd.

Part # FDN361
Description  These devices are particularly suited for low voltage applications in notebook computers,
PDF  5 Pages
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Manufacturer  UMW [Guangdong Youtai Semiconductor Co., Ltd.]
Direct Link  https://www.umw-ic.com/
Logo UMW - Guangdong Youtai Semiconductor Co., Ltd.

FDN361 Datasheet(HTML) 2 Page - Guangdong Youtai Semiconductor Co., Ltd.

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Electrical Characteristics
T
A
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage
VGS = 0 V,
ID = 250
PA
30
V
'BVDSS
'TJ
Breakdown Voltage Temperature
Coefficient
ID = 250
PA,Referenced to 25qC
26
mV/
qC
IDSS
Zero Gate Voltage Drain Current
VDS = 24 V,
VGS = 0 V
1
PA
VDS = 24 V, VGS = 0 V, TJ = 55
qC
10
PA
IGSS
Gate–Body Leakage
VGS =
r20 V,
VDS = 0 V
r100
nA
On Characteristics
(Note 2)
VGS(th)
Gate Threshold Voltage
VDS = VGS,
ID = 250
PA
1
2.1
3
V
RDS(on)
Static Drain–Source
On–Resistance
VGS = 10 V,
ID = 1.4 A
VGS = 4.5 V,
ID = 1.2 A
92
120
110
160
m
:
ID(on)
On–State Drain Current
VGS = 4.5 V,
VDS = 5 V
3.5
A
gFS
Forward Transconductance
VDS = 5 V,
ID = 1.4 A
4
S
Dynamic Characteristics
Ciss
Input Capacitance
145
193
pF
Coss
Output Capacitance
35
47
pF
Crss
Reverse Transfer Capacitance
VDS = 15 V,
V GS = 0 V,
f = 1.0 MHz
15
23
pF
RG
Gate Resistance
VGS = 15 mV,
f = 1.0 MHz
1.6
:
Switching Characteristics (Note 2)
td(on)
Turn–On Delay Time
3
6
ns
tr
Turn–On Rise Time
8
16
ns
td(off)
Turn–Off Delay Time
16
29
ns
tf
Turn–Off Fall Time
VDD = 15 V,
ID = 1 A,
VGS = 10 V,
RGEN = 6
:
2
4
ns
Qg
Total Gate Charge
1.3
1.8
nC
Qgs
Gate–Source Charge
0.5
nC
Qgd
Gate–Drain Charge
VDS = 15 V,
ID = 1.4 A,
VGS = 4.5 V
0.5
nC
Drain–Source Diode Characteristics
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V,
IS = 0.42 A
(Note 2)
0.8
1.2
V
trr
Diode Reverse Recovery Time
IF = 1.4 A,
diF/dt = 100 A/µs
11
22
nS
Qrr
Diode Reverse Recovery Charge
4
nC
Notes:
1.
RTJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RTJC is guaranteed by design while RTCA is determined by the user's board design.
a) 250
qC/W when mounted on a
0.02 in2 pad of 2 oz. copper.
b) 270°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2.
Pulse Test: Pulse Width
d 300 Ps, Duty Cycle d 2.0%
UMW
R
FDN361
www.umw-ic.com
2
UTD Semiconductor Co.,Limited



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