Philips Semiconductors

Product data

NE/SE5539

High frequency operational amplifier

2002 Jan 25

8

CIRCUIT LAYOUT CONSIDERATIONS

As may be expected for an ultra-high frequency, wide-gain

bandwidth amplifier, the physical circuit is extremely critical.

Bread-boarding is not recommended. A double-sided copper-clad

printed circuit board will result in more favorable system operation.

An example utilizing a 28 dB non-inverting amp is shown in Figure 6.

R5 = 20k TRIMPOT (CERMET)

RF = 1.5k (28dB GAIN)

R6 = 470Ω 5% CARBON

RFC 3T # 26 BUSS WIRE ON

FERROXCUBE VK 200 09/3B CORE

BYPASS CAPACITORS

1nF CERAMIC

(MEPCO OR EQUIV.)

Component Side

(Component Layout)

Bottom Plane

R5

R1

R2

VIN

R6

CC

RF

R5

—V

RFC

R4

RFC

X

X

X

X

XX

X

X

XX

X

X

(1)

+V

OPTIONAL

OFFSET

ADJ.

+V

–V

R5

R4

R1

75

RF

+V

RFC

–14

10

8

3

7

NE5539

1nF

1nF

R3

75

VOUT

TERM

470

R6

RFC

1nF

1nF

—V

VIN

R2

+1

75

R1 = 75Ω 5% CARBON

R2 = 75Ω 5% CARBON

R3 = 75Ω 5% CARBON

R4 = 36K 5% CARBON

(Component Side)

SL00575

Figure 6. 28dB Non-Inverting Amp Sample PC Layout