NE8392 datasheet(2/9 Pages) PHILIPS

2 / 9 page

Philips Semiconductors

Product specification

NE8392C

Coaxial transceiver interface for Ethernet/Thin Ethernet

1995 May 1

PIN DESCRIPTIONS

PIN NO.

N PKG

PIN NO.

PLCC

SYMBOL

DESCRIPTION

CD+

CD–

Collision Outputs. Balanced differential line driver outputs which send a 10MHz oscillation signal to

the DTE in the event of a collision, jabber interrupt or heartbeat test.

RX+

RX–

Receiver Outputs. Balanced differential line driver outputs which send the received signal to the

DTE.

TX+

TX–

Transmitter Inputs. Balanced differential line receiver inputs which accept the transmission signal

from the DTE and apply it to the coaxial cable at TXO once it meets Tx squelch threshold.

HBE

Heartbeat Enable. The heartbeat function is disabled when this pin is connected to VEE and enabled

when connected to GND or left floating.

RR+

RR–

External Resistor. A 1k

Ω (1%) resistor connected between these pins establishes the signaling

current at TXO. RR– is internally connected to VEE.

RXI

Receiver Input. This pin is connected directly to the coaxial cable. Received signals are equalized,

amplified, and sent to the DTE through the RX+ pins once it meets Rx squelch threshold.

TXO

Transmitter Output. This pin is connected directly (Thin Ethernet) or through an external isolating

diode (Ethernet) to the coaxial cable.

CDS

Collision Detect Sense. Ground sense connection for the collision detection circuitry. This pin

should be directly connected to the coaxial cable shield to prevent ground drops affecting the

collision threshold voltage.

GND

Positive Supply Pin.

5 to 11

20 to 25

VEE

Negative supply pins. These pins also serve as a low thermal resistance path for extracting heat

from the die. They should, therefore, be connected to a large metal area on the PC board.

NOTE:

1. The IEEE 802.3 name for CD is CI; for RX is DI; for TX is DO.

ABSOLUTE MAXIMUM RATINGS

SYMBOL

PARAMETER

RATING

UNIT

VEE

Supply voltage1

–12

VIN

Voltage at any input1

0 to –12

TSTG

Storage temperature range

–65 to +150

°C

TSOLD

Lead soldering temperature (10sec.)

+300

°C

Recommended max junction temperature2

+130

°C

θJA

Thermal impedance (N and A packages)

°C/W

NOTE:

1. 100% measured in production.

2. The junction temperature is calculated from the following expression:

TJ = TA + θJA [VEE (0.08 + n x 0.05/100) + 8(VEE –2) / R]

where

= Ambient temperature in

°C.

θJA = Thermal resistance of package.

VEE = Normal operating supply voltage in volts.

= Percentage transmitter duty cycle.

= Pull down resistors on the RX and CD pins in

Ω.

The N package is specially designed to have a low

θJA by directly connecting the four center Pins 4, 5, 12, and 13 to the die attachment area.

These four pins then provide a conductive heat flow path from the die to the PCB where they should be soldered to a large area VEE track. For

the A package, Pins 5 to 11 and 19 to 25 should similarly be soldered to a large area VEE and rack.

NE8392 Datasheet(PDF) 2 Page - NXP Semiconductors

NE8392 Datasheet(HTML) 2 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9

Datasheet Download

Link URL