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BAS40 Datasheet(PDF) 18 Page - NXP Semiconductors |
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BAS40 Datasheet(HTML) 18 Page - NXP Semiconductors |
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18 / 21 page ![]() BAS40_1PSXXSB4X_SER_7 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 07 — 12 May 2006 18 of 21 Philips Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Dimensions in mm Fig 28. Reflow soldering footprint SOT416 Reflow soldering is the only recommended soldering method. Fig 29. Reflow soldering footprint SOT666 MSA438 2.00 0.60 (3x) 0.70 1.50 1 2 3 1.10 2.20 0.50 (3x) 0.85 0.60 1.90 solder lands solder resist occupied area solder paste solder lands solder resist placement area occupied area 0.075 Dimensions in mm 2.75 2.45 2.10 1.60 1.20 2.20 2.50 2.00 1.70 1.00 0.30 (2 ×) 0.15 (4 ×) 0.375 (4 ×) 0.40 (6 ×) 0.55 (2 ×) |
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