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PCF8566P Datasheet(PDF) 32 Page - NXP Semiconductors |
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PCF8566P Datasheet(HTML) 32 Page - NXP Semiconductors |
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32 / 40 page ![]() 1998 May 04 32 Philips Semiconductors Product specification Universal LCD driver for low multiplex rates PCF8566 Table 16 Bonding pad locations (dimensions in mm) All x/y coordinates are referenced to centre of chip, (see Fig.25). PAD NUMBER SYMBOL x y PIN 1 SDA 200 −1235 1 2 SCL 400 −1235 2 3 SYNC 605 −1235 3 4 CLK 856 −1235 4 5VDD 1062 −1235 5 6 OSC 1080 −1025 6 7 A0 1080 −825 7 8 A1 1080 −625 8 9 A2 1080 −425 9 10 SA0 1080 −225 10 11 VSS 1080 −25 11 12 VLCD 1080 347 12 13 BP0 1080 547 13 14 BP2 1080 747 14 15 BP1 1080 947 15 16 BP3 1074 1235 16 17 S0 874 1235 17 18 S1 674 1235 18 19 S2 474 1235 19 20 S3 274 1235 20 21 S4 −274 1235 21 22 S5 −474 1235 22 23 S6 −674 1235 23 24 S7 −874 1235 24 25 S8 −1074 1235 25 26 S9 −1080 765 26 27 S10 −1080 565 27 28 S11 −1080 365 28 29 S12 −1080 165 29 30 S13 −1080 −35 30 31 S14 −1080 −235 31 32 S15 −1080 −435 32 33 S16 −1080 −635 33 34 S17 −1080 −835 34 35 S18 −1080 −1035 35 36 S19 −1056 −1235 36 37 S20 −830 −1235 37 38 S21 −630 −1235 38 39 S22 −430 −1235 39 40 S23 −230 −1235 40 |
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