CMD235

DC-18 GHz SP5T Switch

Data Sheet | February 8, 2021 | Subject to change without notice

9 of 12

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Mechanical Information

Notes:

1. All dimensions in microns.

2. No connection required for unlabeled grounds

3. Backside is RF and DC ground.

4. Backside and bond pad metal: Gold.

5. Die is 85 um thick.

6. Bond pad (1) is 100 x 150 um, bond pads (2-4, 9, 10) are 100 x 100 um, and bond pads (5-8) are 75 x 75 um.

1

2

3

5

6

8

7

9

4

10

125.00

1350.00

825.00

1650.00

157.00

543.00

915.50

490.00

635.00

785.00

955.00

125.00

1525.00

1235.00