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MIRA130 Datasheet(PDF) 13 Page - OSRAM GmbH |
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MIRA130 Datasheet(HTML) 13 Page - OSRAM GmbH |
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13 / 52 page ![]() Document Feedback Mira130 Packaging Information Datasheet • PUBLIC DS000715 • v6-00 • 2023-Aug-09 51 │ 12 3.3 RW (reconstructed wafer) Physical Dimensions Max total die count: 8-inch: 1593 ea. Film frame: Compact disco stainless SUS420 Carrier tape: UV tape Figure 8: RW Physical Dimensions Figure 9: Wafer Dimensions Parameter Description Wafer Diameter 200 mm (8 ”) Grinding Thickness 150 μm ± 10 μm Singulated Die Size X = 3750 μm ± 20 μm, Y = 4150 μm ± 20 μm Bond Pad Size X = 80 μm, Y = 88 μm |
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