4 Specifications

4.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

6.5

V

VI

Input voltage range(1)

–0.5

6.5

V

VO

Output voltage range(1) (2)

–0.5

VCC + 0.5

V

IIK

Input clamp current

VI < 0

–50

mA

IOK

Output clamp current

VO < 0

–50

mA

IO

Continuous output current

±50

mA

Continuous current through VCC or GND

±100

mA

Tstg

Storage temperature range

–65

150

°C

(1)

The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

(2)

The value of VCC is provided in the recommended operating conditions table.

4.2 ESD Ratings

VALUE

UNIT

V (ESD)

Electrostatic discharge

Human body model (HBM), per AEC Q100-002(1)

±2000

V

(1)

AEC Q100-002 indicates that HBM stressing must be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

4.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Supply voltage

Operating

2

3.6

V

Data retention only

1.5

VIH

High-level input voltage

VCC = 2.7V to 3.6V

2

V

VIL

Low-level input voltage

VCC = 2.7V to 3.6V

0.8

V

VI

Input voltage

0

5.5

V

VO

Output voltage

0

VCC

V

IOH

High-level output current

VCC = 2.7V

–12

mA

VCC = 3V

–24

IOL

Low-level output current

VCC = 2.7V

12

mA

VCC = 3V

24

TA

Operating free-air temperature

–40

125

°C

4.4 Thermal Information

THERMAL METRIC

(1)

SN74LVC02A-Q1

UNIT

BQA (WQFN)

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

14 PINS

R θJA

Junction-to-ambient thermal resistance

102.3

86

113

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

SN74LVC02A-Q1

SCES465D – JULY 2003 – REVISED MARCH 2024

www.ti.com

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