Philips Semiconductors

Product specification

N-channel TrenchMOS

™ transistor

PHP3055E PHD3055E

MECHANICAL DATA

Fig.17. SOT428 surface mounting package. Centre pin connected to mounting base.

Notes

1. This product is supplied in anti-static packaging. The gate-source input must be protected against static

discharge during transport or handling.

2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18.

3. Epoxy meets UL94 V0 at 1/8".

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT428

98-04-07

0

10

20 mm

scale

Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads

(one lead cropped)

SOT428

E

b2

D1

wA

M

bc

b1

L1

L

13

2

D

E1

HE

L2

Note

1. Measured from heatsink back to lead.

e1

e

A

A2

A

A1

y

seating plane

mounting

base

A1

(1)

D

max.

b

D1

max.

E

max.

HE

max.

w

y

max.

A2

b2

b1

max.

c

E1

min.

ee1

L1

min.

L2

L

A

max.

UNIT

DIMENSIONS (mm are the original dimensions)

0.2

0.2

mm

2.38

2.22

0.65

0.45

0.89

0.71

0.89

0.71

1.1

0.9

5.36

5.26

0.4

0.2

6.22

5.98

4.81

4.45

2.285

4.57

10.4

9.6

0.5

0.7

0.5

6.73

6.47

4.0

2.95

2.55

August 1999

8

Rev 1.200