Analog Integrated Circuit Device Data

Freescale Semiconductor

5

33291L

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Peak Package Reflow Temperature During Reflow (10), (11)

Note 11.

°C

Thermal Resistance

All Outputs ON(12)

Single Output ON(13)

60

45

°C/W

Notes

10.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

11.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

12.

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

13.

Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.

Table 3. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Value

Unit