Analog Integrated Circuit Device Data

Freescale Semiconductor

9

33888

ELECTRICAL CONNECTIONS

MAXIMUM RATINGS

THERMAL RATINGS

Operating Temperature

Ambient

Junction

-40 to 125

-40 to 150

Storage Temperature

-55 to 150

°C

Control Die Thermal Resistance (8)

PQFP

One Low-Side ON

Two Low-Side ON

Three Low-Side ON

Four Low Side ON

All Low-Sides ON

PQFN

One Low-Side ON

Two Low-Side ON

Three Low-Side ON

Four Low Side ON

All Low-Sides ON

12.5

9.3

7.3

5.9

3.2

8.6

6.0

4.6

3.8

2.0

°C/W

Power Die Thermal Resistance (8)

PQFP

One High-Side 2, 3 ON

All High-Sides ON

PQFN

One High-Side 2, 3 ON

All High-Sides ON

0.5

0.15

0.5

0.1

°C/W

Thermal Resistance, Junction to Ambient, Natural Convection,

Four-Layer Board (8)

PQFP

PQFN

33

37

°C/W

Peak Package Reflow Temperature During Reflow (9), (10)

Note 10

°C

Notes

8.

9.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

10.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

> Go to www.freescale.com

> Search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx)]

> Locate your Part Number and in the Details column, select “View”

> Select “Environmental and Compliance Information”

Table 4. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit