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PUMZ1 Datasheet(PDF) 3 Page - NXP Semiconductors |
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PUMZ1 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 8 page ![]() 1999 Apr 14 3 Philips Semiconductors Preliminary specification NPN/PNP general purpose transistors PUMZ1 THERMAL CHARACTERISTICS Note 1. Device mounted on an FR4 printed-circuit board. CHARACTERISTICS Tamb =25 °C unless otherwise specified. Note 1. Pulse test: tp ≤ 300 µs; δ≤ 0.02. SYMBOL PARAMETER CONDITIONS VALUE UNIT Per device Rth j-a thermal resistance from junction to ambient note 1 416 K/W SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per transistor; for the PNP transistor with negative polarity ICBO collector cut-off current IE = 0; VCB =30V − 100 nA IE = 0; VCB =30V; Tj = 150 °C − 10 µA IEBO emitter cut-off current IC = 0; VEB =4V − 100 nA hFE DC current gain IC = 1 mA; VCE = 6 V 120 − VCEsat collector-emitter saturation voltage IC = 50 mA; IB = 5 mA; note 1 − 200 mV Cc collector capacitance IE =ie = 0; VCB = 12 V; f = 1 MHz TR1 − 1.5 pF TR2 − 2.2 pF fT transition frequency IC = 2 mA; VCE = 12 V; f = 100 MHz 100 − MHz |
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