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2010-G Datasheet(PDF) 1 Page - Comchip Technology

Part # 2010-G
Description  Silicon Bridge Rectifiers
PDF  3 Pages
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Manufacturer  COMCHIP [Comchip Technology]
Direct Link  http://www.comchiptech.com
Logo COMCHIP - Comchip Technology

2010-G Datasheet(HTML) 1 Page - Comchip Technology

  2010-G Datasheet HTML 1Page - Comchip Technology 2010-G Datasheet HTML 2Page - Comchip Technology 2010-G Datasheet HTML 3Page - Comchip Technology  
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Comhip Technology Corporation . Tel:510-657-8671 . Fax: 510-657-8921 . www.comchiptech.com
Case: Molded Plastic
Terminals: Plated Leads Solderable Per MIL
STD-202, Method 208
Weight: 1.7 grams (approx.)
Mounting position: Any
Mechanical Data:
Maximum Ratings and Electrical Characteristics
Diffused Junction
Low Forward Voltage Drop
High Reliability
High Current Capability
High Surge Current Capability
Ideal for Printed Circuit Boards
Features:
Reverse Voltage: 50 ~ 1000 Volts
Forward Current: 2.0 Amp
KBP200-G thru 2010-G (RoHS Device)
Silicon Bridge Rectifiers
“-G” suffix designated RoHS compliant version
Dim
A
B
C
D
E
G
H
J
I
Min.
14.22
10.67
11.68
4.57
3.60
2.16
12.70
0.76
1.52
Max
15.24
11.68
12.70
5.08
4.10
2.67
-
0.88
KBP
All Dimension in mm
D
G
E
I
A
B
J
C
H
+ ~ ~ -
KBP
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate currently by 20%.
Characteristics
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (Note1) @ TA = 50ºC
Non-Repetitive Peak Forward Surge Current 8.3ms Single
half-sine-wave superimposed on rated load (JEDEC
Method)
Forward Voltage (per element) @ IF=2.0A
Peak Reverse Current @ TA=25ºC
At Rated DC Blocking Voltage @ TA=100ºC
Rating for Fusing (t<8.3ms)
Typical Thermal Resistance (Note3)
Operating and Storage Temperature Range
Typical Junction Capacitance per element (Note2)
KBP
200-G
50
35
KBP
201-G
100
70
KBP
202-G
200
140
KBP
204-G
400
280
2.0
60
1.1
10
500
15
30
-55 to +160
25
UNIT
V
V
A
A
V
uA
A2S
K/W
ºC
pF
Symbol
VRRM
VRWM
VR
VR(RMS)
Io
IFSM
VFM
IRM
I2t
RθJA
TJ, TSTG
CJ
KBP
206-G
600
420
KBP
208-G
800
560
KBP
2010-G
1000
700
Note:
1. Leads maintained at ambient temperature at a distance of 9.5mm from the case.
2. Measured at 1.0MHz and applied reverse voltage of 4.0V D.C.
3. Thermal resistance junction to ambient mounted on PC board with 12mm2 copper pad.


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