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MPX4115AS Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc |
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MPX4115AS Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc |
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5 / 9 page ![]() MPX4115A MPXA4115A SERIES 5 Motorola Sensor Device Data INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct fottprint, the packages will self–align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 0.060 TYP 8X 1.52 0.100 TYP 8X 2.54 0.100 TYP 8X 2.54 0.300 7.62 Figure 5. SOP Footprint (Case 482) inch mm SCALE 2:1 Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005 |
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