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aSM121
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© Andigilog, Inc. 2004
www.andigilog.com
July 2005 - 70A04006
QFN-3 Package Dimensions and PC Layout Pattern
Note: Solder mask is recommended to be 0.07mm larger than PC lands.
Figure 6. Package Outline
Tape and Reel Data
Figure 7. Tape Dimensions and Part Orientation
Æ1.00 + 0.25
Æ1.50 + 0.10
3.50 ± 0.05
2.00 ± 0.05
8.00 + 0.30
- 0.10
4.00 ± 0.10
4.00 ± 0.10
1.35 ± 0.10
10 MAX
10 MAX
1.75 ± 0.10
1.02 ± 0.10
0.254 ± 0.013
SEC - AA
SEC - AA
SEC - BB
SEC - BB
1.75 ± 0.10
Part
Orientation
Pin 1 Dot
Marking
QFN 3L
(1.2mm x 1.5mm)
Top View
Bottom View
Side View
1.500
± 0.050
1.200
±0.050
1.000
±0.050
1.050
±0.050
1.000 ± 0.050
Exposed Pad
0.200
±0.050
0.350
±0.050
0.500
± 0.050 2-PL
0.000
±0.050
0.750
± 0.025
1
2
3
0.203
±0.025
0.200
±0.050
0.250
± 0.050
0.350
± 0.050
0.2 mm
+ 0.10
-0.0
0.2 mm
+ 0.10
-0.0
0.2 mm
+ 0.10
-0.0
0.6 mm
+ 0.10
-0.0
0.5 mm
+ 0.10
-0.0
0.5 mm
+ 0.10
-0.0
Ref. Package
Outline
1.1 mm
+ 0.10
-0.0
PC Layout Pattern
Pin 1 Dot
Marking
QFN 3L
(1.2mm x 1.5mm)
Top View
Bottom View
Side View
1.500
± 0.050
1.200
±0.050
1.000
±0.050
1.050
±0.050
1.000 ± 0.050
Exposed Pad
0.200
±0.050
0.350
±0.050
0.500
± 0.050 2-PL
0.000
±0.050
0.750
± 0.025
1
2
3
0.203
±0.025
0.200
±0.050
0.250
± 0.050
0.350
± 0.050
0.2 mm
+ 0.10
-0.0
0.2 mm
+ 0.10
-0.0
0.2 mm
+ 0.10
-0.0
0.6 mm
+ 0.10
-0.0
0.5 mm
+ 0.10
-0.0
0.5 mm
+ 0.10
-0.0
Ref. Package
Outline
1.1 mm
+ 0.10
-0.0
PC Layout Pattern
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