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BAP63-03 Datasheet(PDF) 2 Page - NXP Semiconductors |
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BAP63-03 Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 7 page ![]() 2004 Feb 11 2 Philips Semiconductors Product specification Silicon PIN diode BAP63-03 FEATURES • High speed switching for RF signals • Low diode capacitance • Low diode forward resistance • Very low series inductance • For applications up to 3 GHz. APPLICATIONS • RF attenuators and switches. DESCRIPTION Planar PIN diode in a SOD323 small SMD plastic package. PINNING PIN DESCRIPTION 1 cathode 2 anode sym006 Top view 2 1 Marking code: D2. The marking bar indicates the cathode. Fig.1 Simplified outline (SOD323) and symbol. ORDERING INFORMATION LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION BAP63-03 − plastic surface mounted package; 2 leads SOD323 SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VR continuous reverse voltage − 50 V IF continuous forward current − 100 mA Ptot total power dissipation Ts ≤ 90 °C − 500 mW Tstg storage temperature −65 +150 °C Tj junction temperature −65 +150 °C |
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