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IRFR110ATM Datasheet(PDF) 2 Page - BYCHIP ELECTRONICS CO., LIMITED

Part # IRFR110ATM
Description  N-channel Enhancement Mode Power MOSFET
PDF  4 Pages
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Manufacturer  BYCHIP [BYCHIP ELECTRONICS CO., LIMITED]
Direct Link  http://www.bychip.cn/
Logo BYCHIP - BYCHIP ELECTRONICS CO., LIMITED

IRFR110ATM Datasheet(HTML) 2 Page - BYCHIP ELECTRONICS CO., LIMITED

  IRFR110ATM Datasheet HTML 1Page - BYCHIP ELECTRONICS CO., LIMITED IRFR110ATM Datasheet HTML 2Page - BYCHIP ELECTRONICS CO., LIMITED IRFR110ATM Datasheet HTML 3Page - BYCHIP ELECTRONICS CO., LIMITED IRFR110ATM Datasheet HTML 4Page - BYCHIP ELECTRONICS CO., LIMITED  
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background image
Symbol
Min.
Typ.
Max.
Unit
V(BR)DSS
100
V
VDS =80V, VGS = 0V
1.0
TJ = 55°C
5.0
IGSS
±100
nA
Gate Threshold Voltage
VGS(th)
1.2
3.0
V
57
m
70
m
gFS
11.0
S
VSD
0.70
1.0
V
IS
45
A
Ciss
187
pF
Coss
54
pF
Crss
5.0
pF
Rg
1.4
Qg
3.9
nC
Qg
2.2
nC
Qgs
0.50
nC
Qgd
1.1
nC
tD(on)
2.6
ns
tr
3.5
ns
tD(off)
9.4
ns
tf
5.5
ns
trr
30
ns
Qrr
16.1
nC
Symbol
Unit
RJA
°C/W
RJC
°C/W
Notes:
2.8
IF = 9.0A, dIF/dt = 100A/s
Parameter
SWITCHING PARAMETERS
(5)
2. This single-pulse measurement was taken under TJ_Max = 150°C.
3. This single-pulse measurement was taken under the following condition [L = 100
H, VGS = 10V, VDD = 50V] while its value is limited by
4. The power dissipation PD is based on TJ_Max = 150°C.
5. This value is guaranteed by design hence it is not included in the production test.
TJ_Max = 150°C.
1. Computed continuous current assumes the condition of TJ_Max while the actual continuous current depends on the thermal & electro-mechanical
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
Typ.
Thermal Performance
Max.
VGS = 4.5V, ID = 6.0A
Static Drain-Source ON-Resistance
RDS(ON)
TC = 25°C
Input Capacitance
VGS = 0V, VDS = 50V, f = 1MHz
Output Capacitance
Reverse Transfer Capacitance
DYNAMIC PARAMETERS
(5)
application board design.
Gate Resistance
VGS = 0V, VDS= 0V, f = 1MHz
Total Gate Charge (@ VGS = 10V)
VGS = 0 to 10V
VDS = 50V, ID = 9.0A
Total Gate Charge (@ VGS = 4.5V)
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
VGS = 10V, VDS = 50V
RL = 5.6, RGEN = 6
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
66
3.6
55
Parameter
Conditions
Drain-Source Breakdown Voltage
ID = 250A, VGS = 0V
STATIC PARAMETERS
Electrical Characteristics (@ T
J = 25°C unless otherwise specified)
A
Gate-Body Leakage Current
VDS = 0V, VGS = ±20V
Body Diode Reverse Recovery Time
IF = 9.0A, dIF/dt = 100A/s
Body Diode Reverse Recovery Charge
Zero Gate Voltage Drain Current
IDSS
VDS = VGS, ID = 250A
Diode Continuous Current
VGS = 10V, ID = 9.0A
Forward Transconductance
VDS = 5V, ID = 7.5A
Diode Forward Voltage
IS = 1A, VGS = 0V
www.bychip.cn
IRFR110ATM
v2.0



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