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BAS70W Datasheet(PDF) 11 Page - NXP Semiconductors |
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BAS70W Datasheet(HTML) 11 Page - NXP Semiconductors |
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11 / 20 page ![]() BAS70_1PS7XSB70_SER_8 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Product data sheet Rev. 08 — 4 May 2006 11 of 20 Philips Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes 10. Soldering Dimensions in mm Fig 14. Reflow soldering footprint SOD323 (SC-76) Dimensions in mm Fig 15. Wave soldering footprint SOD323 (SC-76) Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 16. Reflow soldering footprint SOD523 (SC-79) msa433 1.65 0.50 (2 ×) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste MSA415 1.40 4.40 5.00 1.20 2.75 solder lands solder resist occupied area preferred transport direction during soldering MGS343 solder lands solder resist occupied area solder paste 1.80 1.90 0.30 0.40 0.50 1.20 0.60 2.15 |
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