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© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Product data sheet

Rev. 01 — 7 April 2005

2 of 8

Philips Semiconductors

BAT54H

Schottky barrier single diode in SOD123F package

3.

Ordering information

4.

Marking

5.

Limiting values

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Reflow soldering is the only recommended soldering method.

[3]

Soldering point of cathode tab.

Table 3:

Ordering information

Type number

Package

Name

Description

Version

BAT54H

-

plastic surface mounted package; 2 leads

SOD123F

Table 4:

Marking codes

Type number

Marking code

BAT54H

AG

Table 5:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

reverse voltage

-

30

V

forward current

-

200

mA

repetitive peak forward

current

-

300

mA

non-repetitive peak forward

current

-

600

mA

total power dissipation

[1] -

375

mW

junction temperature

-

125

°C

ambient temperature

−65

+125

°C

storage temperature

−65

+150

°C

Table 6:

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from junction to

ambient

in free air

[1] [2] -

-

330

K/W

thermal resistance from junction to

solder point

[3] -

-

70

K/W