SPX2815 datasheet(3/10 Pages) SIPEX

3 / 10 page

Date: 6/21/06 Rev C

SPX2815 1.5A Low Dropout Voltage Regulator

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 1. Line Regulation for SPX2815U-3.3; I

OUT=10mA

3.300

3.305

3.310

3.315

3.320

3.325

4.5

6.5

8.5

10.5

12.5

14.5

Vin (V)

1.225

1.23

1.235

1.24

1.245

1.25

1.255

1.26

1.265

1.27

1.275

-50

-30

-10

110

130

Temp (C)

1.25v Adj

Figure 2. V

OUT vs Temperature, VIN=2.5V, IOUT=10mA

Figure 3. V

IN=4.0V, IOUT=10mA

2.45

2.46

2.47

2.48

2.49

2.5

2.51

2.52

2.53

2.54

2.55

-50

-30

-10

110

130

Temp (C)

2.5v Adj

2.5v Fixed

Figure 4. V

IN=5.0V, IOUT=10mA

3.26

3.28

3.3

3.32

3.34

3.36

3.38

-50

-30

-10

110

130

Temp (C)

3.3v Adj

3.3v Fixed

Output Capacitor

To ensure the stability of the SPX2815, an

output capacitor of at least 10

μF (ceramic or

tantalum) or 22

μF (aluminum) is required. The

value may change based on the application

requirements of the output load or temperature

range. The value of Equivalent Series Resis-

tance (ESR) can vary based on the type of

capacitor used in the applications to guarantee

stability. The recommended value for ESR is

0.5

Ω or less. A larger value of output capaci-

tance (up to 100

μF) can improve the load tran-

sient response.

Soldering Methods

The SPX2815 die is attached to the heatsink lead

which exits opposite the input, output, and ground

pins.

Thermal Characteristics

The SPX2815 features internal thermal limiting

to protect the device during overload condi-

tions. Special care needs to be taken during

continuous load conditions such that the maxi-

mum junction temperature does not exceed

125

°C. Thermal protection is activated at >179°C

and deactiviated at <165

°C.

The thermal interaction from other components

in the application can affect the thermal resis-

tance of the SPX2815.

The actual thermal

resistance can be determined with experimenta-

tion.

SPX2815 power dissipation is calculated as

follows:

D = (VIN - VOUT)(IOUT)

Maximum Junction Temperature range:

J = TA(max) + PD* θJA (thermal resistance,

junction-to-ambient)

Maximum junction temperature must not ex-

ceed 125

°C.

APPLICATION INFORMATION

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