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SAA7712 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # SAA7712
Description  Sound effects DSP
PDF  44 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

SAA7712 Datasheet(HTML) 2 Page - NXP Semiconductors

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1999 Aug 05
2
Philips Semiconductors
Preliminary specification
Sound effects DSP
SAA7712H
CONTENTS
1
FEATURES
1.1
Hardware features
1.2
Software features
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
QUICK REFERENCE DATA
5
ORDERING INFORMATION
6
BLOCK DIAGRAM
7
PINNING INFORMATION
8
FUNCTIONAL DESCRIPTION
8.1
Analog outputs
8.1.1
Analog output circuit
8.1.2
DAC frequency
8.1.3
DACs
8.1.4
Upsample filter
8.1.5
Performance
8.1.6
Power-On Mute (POM)
8.1.7
Power-off plop suppression
8.1.8
Pin VREFDA
8.1.9
Internal DAC current reference
8.1.10
Supply of the analog outputs
8.2
I2S-bus inputs and outputs
8.2.1
Digital data stream formats
8.2.2
Slave I2S-bus inputs
8.2.3
Master I2S-bus inputs and outputs
8.3
Equalizer accelerator
8.3.1
Introduction
8.3.2
Configuration of equalizer sections
8.3.3
Overflow detection
8.4
Clock circuit and oscillator
8.4.1
General description
8.4.2
Supply of the crystal oscillator
8.5
Programmable phase-locked loop circuit
8.6
I2C-bus control
8.6.1
Introduction
8.6.2
Characteristics of the I2C-bus
8.6.3
Bit transfer
8.6.4
Start and stop conditions
8.6.5
Data transfer
8.6.6
Acknowledge
8.6.7
State of the I2C-bus interface during and after
Power-on reset
8.7
External control pins
8.8
Reset pin
8.9
Power supply connection and EMC
8.10
Test mode connections
9I2C-BUS FORMAT
9.1
Addressing
9.2
Slave address (pin A0)
9.3
Write cycles
9.4
Read cycles
9.5
I2C-bus memory map summary
9.6
I2C-bus memory map details
10
LIMITING VALUES
11
THERMAL CHARACTERISTICS
12
DC CHARACTERISTICS
13
ANALOG OUTPUTS CHARACTERISTICS
14
OSCILLATOR CHARACTERISTICS
15
I2S-BUS TIMING CHARACTERISTICS
16
I2C-BUS TIMING CHARACTERISTICS
17
APPLICATION INFORMATION
18
PACKAGE OUTLINE
19
SOLDERING
19.1
Introduction to soldering surface mount
packages
19.2
Reflow soldering
19.3
Wave soldering
19.4
Manual soldering
19.5
Suitability of surface mount IC packages for
wave and reflow soldering methods
20
DEFINITIONS
21
LIFE SUPPORT APPLICATIONS
22
PURCHASE OF PHILIPS I2C COMPONENTS



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