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SC26C562 Datasheet(PDF) 8 Page - NXP Semiconductors |
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SC26C562 Datasheet(HTML) 8 Page - NXP Semiconductors |
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8 / 22 page ![]() Philips Semiconductors Product specification SC26C562 CMOS dual universal serial communications controller (CDUSCC) 1998 Sep 04 8 DC ELECTRICAL CHARACTERISTICS4,5 TA = 0°C to +70°C, VCC = 5.0V +10%4,5 SYMBOL PARAMETER TEST CONDITIONS LIMITS UNIT SYMBOL PARAMETER TEST CONDITIONS Min Typ Max UNIT Input low voltage: VIL All except X1/CLK 0.8 V X1/CLK 0.8 V VIH Input high voltage except X1/CLK 0 to 70 _C 2.0 V –40 to +85 _C 2.3 V X1/CLK 0.8 x VCC VCC V VOL Output low voltage: All except IRQN7 IOL=5.3mA(Comm), 4.8mA(Ind) V IRQN IOL=8.8mA(Comm), 7.8mA(Ind) 0.5 V VOH Output high voltage: 0.5 (Except open drain outputs) IOH = –400µA VCC–0.5 V IILX1 X1/CLK input low current10 VIN = 0, X2 = open –150 0.0 µA IIHX1 X1/CLK input high current10 VIN = VCC, X2 = GND –150 150 µA ISCX2 X2 short circuit current X1 = open, VIN = 0 VIN = VCC –15 +15 mA mA IIL Input low current –15 IIL RESETN, TxDAKN, RxDAKN VIN = 0 –15 –0.5 µA II Input leakage current VIN = 0 to VCC, 0 to 70_C –40 to +85 _C –1 –10 +1 +10 µA IOZH Output off current high, 3-State data bus VIN = VCC, 0 to 70_C –40 to +85 _C +1 +10 µA IOZL Output off current low, 3-State data bus VIN = 0, 0 to 70_C –40 to +85 _C –1 –10 µA IODL Open drain output low current in off state: EOPN, RDYN –15 –0.5 µA IRQN VIN = 0 –1 µA IODH Open drain output high current in off state: EOPN, IRQN, RDYN VIN = VCC –1 1 µA ICC13 Power supply current (see Figure 19 for graphs) 0 to 70 _C –40 to +85 _C 25 80 95 mA CIN Input capacitance9 VCC = GND = 0 10 pF COUT Output capacitance9 VCC = GND = 0 15 pF CI/O Input/output capacitance9 VCC = GND = 0 20 pF NOTES: 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation section of this specification is not implied. 2. Clock may be stopped (DC) for testing purposes, or when CDUSCC is in non-operational modes. 3. This product includes circuitry specifically designed for the protection of its internal devices from damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying any voltages larger than the rated maxima. 4. Parameters are valid over specified temperature range. 5. All voltage measurements are referenced to ground (GND). For testing, all inputs except X1/CLK swing between 0.2V and 3.0V with a transi- tion time of 20ns maximum. For X1/CLK, this swing is between 0.2V and 4.4V. All time measurements are referenced at input voltages of 0.2V and 3.0V and output voltages of 0.8V and 2.0V, as appropriate. 6. See Figure 20 for test conditions for outputs. 7. Tests for open drain outputs are intended to guarantee switching of the output transistor. Measurement of this response is referenced from midpoint of the switching signal to a point 0.2V above the actual output signal level. This point represents noise margin that assures true switching has occurred. 8. Execution of the valid command (after it is latched) requires 3 rising edges of X1 (see Figure 15). 9. These values were not explicitly tested; they are guaranteed by design and characterization data. 10. X1/CLK and X2 are not tested with a crystal installed. 11. X1/CLK frequency must be at least the faster of the receiver or transmitter serial data rate. 12. Timing is illustrated and referenced to the WRN and RDN inputs. The device may also be operated with CSN as the ‘strobing’ input. CSN and RDN (also CSN and WRN) are ANDed internally. As a consequence, the signal asserted last initiates the cycle and the signal negated first terminates the cycle. 13. VO = 0 to VCC, Rx and Tx clocks at 10MHz, X1 clock at 10MHz. |
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