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SC26C562 Datasheet(PDF) 8 Page - NXP Semiconductors

Part # SC26C562
Description  CMOS dual universal serial communications controller CDUSCC
PDF  22 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

SC26C562 Datasheet(HTML) 8 Page - NXP Semiconductors

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Philips Semiconductors
Product specification
SC26C562
CMOS dual universal serial communications controller
(CDUSCC)
1998 Sep 04
8
DC ELECTRICAL CHARACTERISTICS4,5 TA = 0°C to +70°C, VCC = 5.0V +10%4,5
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNIT
SYMBOL
PARAMETER
TEST CONDITIONS
Min
Typ
Max
UNIT
Input low voltage:
VIL
All except X1/CLK
0.8
V
X1/CLK
0.8
V
VIH
Input high voltage except X1/CLK
0 to 70
_C
2.0
V
–40 to +85
_C
2.3
V
X1/CLK
0.8 x VCC
VCC
V
VOL
Output low voltage:
All except IRQN7
IOL=5.3mA(Comm), 4.8mA(Ind)
V
IRQN
IOL=8.8mA(Comm), 7.8mA(Ind)
0.5
V
VOH
Output high voltage:
0.5
(Except open drain outputs)
IOH = –400µA
VCC–0.5
V
IILX1
X1/CLK input low current10
VIN = 0, X2 = open
–150
0.0
µA
IIHX1
X1/CLK input high current10
VIN = VCC, X2 = GND
–150
150
µA
ISCX2
X2 short circuit current
X1 = open, VIN = 0
VIN = VCC
–15
+15
mA
mA
IIL
Input low current
–15
IIL
RESETN, TxDAKN, RxDAKN
VIN = 0
–15
–0.5
µA
II
Input leakage current
VIN = 0 to VCC, 0 to 70_C
–40 to +85
_C
–1
–10
+1
+10
µA
IOZH
Output off current high, 3-State data bus
VIN = VCC, 0 to 70_C
–40 to +85
_C
+1
+10
µA
IOZL
Output off current low, 3-State data bus
VIN = 0, 0 to 70_C
–40 to +85
_C
–1
–10
µA
IODL
Open drain output low current in off
state:
EOPN, RDYN
–15
–0.5
µA
IRQN
VIN = 0
–1
µA
IODH
Open drain output high current in off
state:
EOPN, IRQN, RDYN
VIN = VCC
–1
1
µA
ICC13
Power supply current
(see Figure 19 for graphs)
0 to 70
_C
–40 to +85
_C
25
80
95
mA
CIN
Input capacitance9
VCC = GND = 0
10
pF
COUT
Output capacitance9
VCC = GND = 0
15
pF
CI/O
Input/output capacitance9
VCC = GND = 0
20
pF
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any other conditions above those indicated in the operation section of this specification is not
implied.
2. Clock may be stopped (DC) for testing purposes, or when CDUSCC is in non-operational modes.
3. This product includes circuitry specifically designed for the protection of its internal devices from damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying any voltages larger than the rated maxima.
4. Parameters are valid over specified temperature range.
5. All voltage measurements are referenced to ground (GND). For testing, all inputs except X1/CLK swing between 0.2V and 3.0V with a transi-
tion time of 20ns maximum. For X1/CLK, this swing is between 0.2V and 4.4V. All time measurements are referenced at input voltages of
0.2V and 3.0V and output voltages of 0.8V and 2.0V, as appropriate.
6. See Figure 20 for test conditions for outputs.
7. Tests for open drain outputs are intended to guarantee switching of the output transistor. Measurement of this response is referenced from
midpoint of the switching signal to a point 0.2V above the actual output signal level. This point represents noise margin that assures true
switching has occurred.
8. Execution of the valid command (after it is latched) requires 3 rising edges of X1 (see Figure 15).
9. These values were not explicitly tested; they are guaranteed by design and characterization data.
10. X1/CLK and X2 are not tested with a crystal installed.
11. X1/CLK frequency must be at least the faster of the receiver or transmitter serial data rate.
12. Timing is illustrated and referenced to the WRN and RDN inputs. The device may also be operated with CSN as the ‘strobing’ input. CSN
and RDN (also CSN and WRN) are ANDed internally. As a consequence, the signal asserted last initiates the cycle and the signal negated
first terminates the cycle.
13. VO = 0 to VCC, Rx and Tx clocks at 10MHz, X1 clock at 10MHz.



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