DML3012LDC

Document number: DS44725 Rev. 8 - 2

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June 2024

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DML3012LDC

Application Information (continued)

Thermal Shutdown

The DML3012LDC device has equipped thermal shutdown protection for internally or externally generated excessive temperatures. This circuitry is

disabled when EN is not active to reduce standby current. When an overtemperature condition is detected, the MOSFET immediately turns off, and

the load bleed is active.

The part comes out of thermal shutdown when the junction temperature decreases to a safe operating temperature as dictated by the thermal

hysteresis. Upon exiting a thermal shutdown state and if EN remains active, the MOSFET turns on in a controlled fashion with the normal output

turn-on delay and slew rate.

Undervoltage Lockout

The DML3012LDC device has equipped undervoltage lockout protection. The DML3012LDC turns the MOSFET off and activates the load bleed

when the input voltage, VCC, is less than or equal to the undervoltage lockout threshold. This circuitry is disabled when EN is not active to reduce

standby current.

If the VCC voltage rises above the undervoltage lockout threshold and EN remains active, the MOSFET turns on in a controlled fashion with the

normal output turn-on delay and slew rate.

PCB Layout Consideration

1.

Place the input/output capacitors CVIN and CVOUT as close as possible to the VIN and VOUT pins.

2.

The power traces, which are VIN trace, VOUT trace, and GND trace, should be short, wide, and direct for minimize parasitic inductance.

3.

Place feedback resistance RBLEED as close as possible to BLEED pin.

4.

The SR trace must be as short as possible to reduce parasitic capacitance.

5.

Place CVCC capacitor near the device pin.

6.

Connect the signal ground to the GND pin, and keep a single connection from GND pin to the power ground behind the input or output

capacitors.

7.

For better power dissipation, via holes are recommend to connect the exposed pad’s landing area to a large copper polygon on the other side

of the PCB. The copper polygons and exposed pad shall connect to VIN pin on the printed circuit board.

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VIN

EN

Vcc

GND

SR

PG

VOUT

VOUT

VOUT

VOUT

VOUT

BLEED

GND (Power)

CVIN

CVOUT

RPG

CVCC

VOUT

VIN

RBLEED

VIN

CSR

VTERM

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