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Model 143

CERAMIC BOARD (A)

Our hybrids use ceramic (alumina) substrates to

achieve optimum size reduction and reliability.

Ceramic substrates produce an environmentally

superior product. The advantages of ceramic over

polymer board construction include: better heat

dissipation, elimination of blistering, minimal moisture

absorption, reduced size and improved performance.

For small-sized assemblies (up to approx. 2” x 2”),

ceramic board construction is usually the low cost

choice. Thick film conductors, typically Palladium

silver or gold, as small as 5 mil wide, are screened

onto the substrate. Multilayer construction of up to

five metal layers is standard.

PRECISION SCREENED RESISTORS (B)

Thick film resistors are screened directly onto the

substrate utilizing a wide range of resistor inks,

yielding high precision at low cost. Our thick film

resistors can be ratio matched to 0.1% with absolute

tolerances of 0.5%. Thick film resistors can be located

underneath surface mount devices, or screened onto

the back of the substrate for increased circuit

densities.

INTERCONNECT FLEXIBILITY (C)

Lead frames can be attached to accommodate a variety

of interconnection requirements. Leads can be affixed

to any or all edges of the substrate and can be

configured for various mounting styles. Additionally, a

wide variety of standard sockets can be attached to

allow plug-in capability to your next level of assembly.

SURFACE MOUNT SEMICONDUCTORS (D)

BI has experience with a wide range of surface

mountable

semiconductors

in

packaged

configurations, including SOT, SO, SOL and PLCC.

Our commercial hybrids will also accommodate

semiconductor die attached and wire bonded directly

to the substrate. This allows us to utilize ASICs and

other semiconductors not currently offered in a

surface mountable package.

SURFACE MOUNT PASSIVE COMPONENTS (E)

Ceramic and tantalum capacitors, chip inductors and

resistor chips all lend themselves to surface mount

assembly. Axial leaded components can be formed

and mounted as well.

ENCAPSULATION (F)

Surface mount hybrids do not normally require

encapsulation. However, encapsulation may be

applied if desired for rigidity or for protection of

proprietary circuit design. When chip and wire

elements are used, these are generally individually

“glob-topped” to provide protection for the device; the

entire module may then be fully encapsulated.