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Model 170

DESCRIPTION

BI’s Custom Power Modules are designed to assemble all

of your circuit’s power components into one, easy to

manage, package. Power modules offer a low cost

method to improve the circuit density. These modules will

also reduce the assembly labor by eliminating insulating

pads and reducing the individual bolting of discreet power

semiconductors. BI offers power module designs that

allow the module to be soldered to the circuit board at the

same time as the other components, eliminating hand

soldering operations. Power modules allow the use of a

simpler and less expensive heat sink.

All the power components normally bolted to the heat sink

should be included in the custom module.

• Power supply subassemblies

• Motor driver

• Power amplifier

• H-Bridge

• Bridge rectifier

• Ganged power FETs

MODEL 170

Custom Power Modules

CUSTOM POWER MODULES

Package Size

Custom packaging from 0.3” to 4.0” on a side.

Package, Typical

Heat sink attachment and heat transfer.

Package Configurations

Ceramic substrate, typically copper clad to promote heat transfer.

Base with mounted components is assembled into a custom frame and encapsulated.

PACKAGING

FEATURES AND BENEFITS

• Low cost custom modules

• Reduced circuit size

• Allows simplified heat sink

• Soldering technique minimizes voids

• Flexible package dimensions

TYPICAL APPLICATIONS

Specifications subject to change without notice.