ADN2804

Data Sheet

Rev. D | Page 24 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

Figure 30. 32-Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADN2804ACPZ

−40°C to +85°C

32-Lead LFCSP_WQ

CP-32-7

ADN2804ACPZ-500RL7

−40°C to +85°C

32-Lead LFCSP_WQ, 7”Tape-Reel, 500 Pieces

CP-32-7

ADN2804ACPZ-RL7

−40°C to +85°C

32-Lead LFCSP_WQ, 7”Tape-Reel, 1500 Pieces

CP-32-7

EVAL-ADN2804EBZ

Evaluation Board

1 Z = RoHS Compliant Part.

I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).

©2006–2014 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D05801-0-4/14(D)