MP6614

– 35V, H-BRIDGE DC MOTOR DRIVER WITH SOIC-8 PACKAGE

MP6614 Rev. 1.0

MonolithicPower.com

4

2/24/2023

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© 2023 MPS. All Rights Reserved.

PIN FUNCTIONS

Pin #

Name

Description

1

GND

Ground.

2

IN2

Input 2. Internal pull-down resistor 1.

3

IN1

Input 1. Internal pull-down resistor 2.

4

ISET

Output current-setting resistor. Connect a resistor between the ISET pin and ground to

set the current limit and the VISEN

pin’s output voltage.

5

VIN

Supply voltage. Place an input capacitor connected to the VIN pin to minimize voltage

spikes at the input.

6

OUT1

Output terminal 1.

7

VISEN

Current-sense output voltage.

8

OUT2

Output terminal 2.

EP

GND

Exposed pad. Connect the exposed pad to GND.

ABSOLUTE MAXIMUM RATINGS (1)

Supply voltage (VIN) ......................-0.3V to +38V

Output voltages (VOUT1, VOUT2).............................

…………………………………-0.3V to VIN + 0.3V

ISET voltage (VISET) ........................-0.3V to +5V

All other pins to GND ......................-0.3V to +6V

Continuous power dissipation

……..(TA = 25°C) (2)

SOIC-8EP .................................................. 2.6W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +150°C

ESD Ratings

Human body model (HBM) ..........................1KV

Charged device model (CDM) ................... 750V

Recommended Operating Conditions (3)

VIN…………………………………………5V to 35V

Continuous output current (IOUT) .................. ±2A

Load current (IVISEN) .................................. ±2mA

Operating junction temp (TJ) .... -40°C to +125°C

Thermal Resistance (4)

θJA

θJC

SOIC-8EP ...............................48 ...... 10 ... °C/W

Notes:

1)

Exceeding these ratings may damage the device.

2)

The maximum allowable power dissipation is a function of

the maximum junction temperature, TJ (MAX), the junction-

to-ambient thermal

resistance,

θ

JA,

and the

ambient

temperature, TA. The maximum allowable continuous power

dissipation at any ambient temperature is calculated by PD

(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum

allowable power dissipation may produce an excessive die

temperature, which can cause the regulator to go into

thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3)

The device is not guaranteed to function outside of its

operation conditions.

4)

Measured on JESD51-7, a 4-layer PCB.