TDA8003TSSLASHC1 datasheet(2/24 Pages) PHILIPS

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2000 Apr 20

Philips Semiconductors

Product speciﬁcation

I2C-bus SIM card interface

TDA8003TS

FEATURES

• Subscriber Identification Module (SIM) card interface in

accordance with GSM11.11, GSM11.12 (Global System

for Mobile communication) and ISO 7816 requirements

• VCC regulation (3 or 5 V ±8%) with controlled rise and

fall times

• Card take-off protection

• One protected and buffered pseudo-bidirectional I/O line

(I/O referenced to VCC and SIMI/O referenced to VDDI)

• Clock generation (up to 10 MHz) with synchronous start

and frequency doubling

• Clock stop LOW, clock stop HIGH or 1.25 MHz (from

internal oscillator) for cards Power-down mode

• Automatic activation and deactivation sequences of an

independent sequencer

• Automatic processing of pin RST with count of the CLK

cycles for start of the Answer To Reset (ATR)

• Warm reset command

• Supply voltage supervisor for Power-on reset, spike

killing and emergency deactivation in case of supply

drop-out

• DC-to-DC converter (doubler, tripler or follower)

allowing operation in a 3 or 5 V environment

(2.5

≤ VDD ≤ 6V)

• Enhanced Electrostatic Discharge (ESD) protections on

card side (6 kV minimum)

• Power-down mode with several active features and

current reduction

• Off mode with 2 µA current

• Control from a microcontroller via a 400 kHz slave

I2C-bus (4 possible addresses: 48H, 4AH, 4CH

and 4EH)

• Four parallel devices possible due to 2 sub-address

wires

• Interface signals supplied by an independent voltage

(1.5

≤ VDDI ≤ 6 V).

APPLICATIONS

• GSM mobile phones

• SAM interfaces in banking terminals

• Portable card readers, etc.

GENERAL DESCRIPTION

The TDA8003TS is a low cost one chip SIM interface, in

accordance with GSM11.11, GSM11.12 and EMV96

(Europay, Mastercard, Visa) with card current limitation.

Controlled by I2C-bus, it is optimized in terms of board

space, external components count and connection count

(see Chapter “Application information”).

The integrated DC-to-DC converter ensures full

cross-compatibility between 3 or 5 V cards and 3 or 5 V

environments. The very low-power consumption in

Power-down mode and Off mode saves battery power.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA8003TS/C1

SSOP24

plastic shrink small outline package; 24 leads; body width 5.3 mm

SOT340-1

TDA8003TS/C2

SSOP24

plastic shrink small outline package; 24 leads; body width 5.3 mm

SOT340-1

TDA8003TS/C1 Datasheet(PDF) 2 Page - NXP Semiconductors

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